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內(nèi)容簡介
FEATURES
?Lowest molded height (3.0 mm) in this package
footprint
?Shielded construction
?Frequency range up to 5.0 MHz
?Lowest DCR/μH, in this package size
?Handles high transient current spikes without saturation
?Ultra low buzz noise, due to composite construction
?Encapsulated body offers improved environmental
protection and moisture resistance
?Higher dielectric withstanding voltage vs. IHLP
?Flame retardant encapsulant (UL 94 V-0)
?Corrosion resistant package
?Compliant to RoHS directive 2002/95/EC
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