內容簡介
FEATURES
?UL recognition file number E54214
?Thin single in-line package
?Glass passivated chip junction
?High surge current capability
?High case dielectric strength of 2500 VRMS
?Solder dip 260 °C, 40 s
?Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
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